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September 2006

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From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Fri, 1 Sep 2006 10:59:54 -0400
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Hi, 
I am a little confused between RoHS part exemptions and application exemptions. For e.g. a BGA component can be RoHS compliant even if the 1st level interconnects have high lead solder because there is a specific lead exemption for this application....correct? now is there a document that says that high lead-solder can be used for 1st level interconnects ONLY for certain part types (for e.g. BGAs and some others?) to be RoHS compliant, or it is independent of the part type?

Can this BGA now be used in a non exempt application assembly and still not violate the RoHS compliancy of that assembly?

We have a particular component (Not BGA) where a high Pb solder will have to be used so that the 1st level interconnect will not melt when exposed to LF soldering temperatures during assembly. The final assembly is a non exempt product.

Regards,

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc. 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
Fax: (607) 687-9733
[log in to unmask]
www.harvardgrp.com




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