Bad pull force?
Inge



----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 05, 2006 3:50 PM
Subject: Re: [TN] Pad pull force


In a message dated 9/5/06 0:45:08, [log in to unmask] writes:
> Is there a standard that defines a minimum pull force requirement after
> the
> component has been soldered.
> A: No, there is no such standard. A properly wetted solder joint is
> stronger
than the attachment of the soldering pads to the PCB/component resin matrix.

> The issue is, to get a better joint we had introduced extra solder to the
> component (confirms to IPC-610D).
> A: Why do you think that more solder will give you a "better joint"? What
does better mean?

> Do we have a minimum pull force value which can be adopted so
> that we can give assurance to customer that there will be no issue with
> joints.
> A: Solder joint issues come from either low quality—meaning inadequate
metalurgical bond due to insufficient wetting; or from creep-fatigue which
is not
very dependent on solder joint volume. So, you are reallly asking the wrong
question.

Werner

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