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September 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Thu, 28 Sep 2006 16:49:46 -0400
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Phil

The general philosophy I normally suggest is for the customer to specify the
end point requirements wherever possible. Then allow the vendor to create a
structure fitting these requirements. Before going into production, the two
parties review the requirements and structure. A good example is never
specify impedance, line width and dielectric thickness altogether; this over
specifies the design. It is far better to specify the impedance and final
board thickness; let the vendor find the design best fitted for your
requirements.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Anslow, Phillip" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, September 28, 2006 3:45 AM
Subject: [TN] Build Structure Communication


Dear Fellow TechNetters,

Would you please share how you communicate your PCB build structures to PCB
fabricators, or, if you are a fabricator, how those which are easiest to
understand are presented to you.

For copper, is it best to quote (i) Nominal start weight or thickness, (ii)
minimum finished thickness to IPC-2221A tables before and/or after plating
if applicable?

For dielectric thickness, (i) specify value, (ii) give range (iii) leave
open?

Your advice and expertise is greatly appreciated.

Many thanks and regards,

Phil



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