Joe,

What type of cleaner do you have? Does it have a standard 2 blower drying with IR assist or other? What is the dwell time within the dryer module(s) within the washer? We do what you are describing and have had no issues to speak of, but we do have a good washer with excellent drying capacity... Please describe your wash process...

CAS

Chris Schaefer
Suntron Corporation
Process Engineer
540 N. Rogers Road
Olathe, Kansas 66062
913.393.5878
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Macko, Joe @ IEC
Sent: Wednesday, September 06, 2006 11:31 AM
To: [log in to unmask]
Subject: [TN] Populated board bake out after 1st side reflow/DI wash


Fellow techs,



Hello.

A general question came up about the need to re-bake a double sided board
after 1st side reflow/DI wash before starting 2nd side assembly. The concern
is that the board (or mounted MSDs) may absorb enough moisture going through
the high-pressure DI water in-line cleaner to potentially cause a problem
during 2nd side reflow. There are some MSDs mounted on the 1st side but both
sides are assembled before exceeding any of the component's floor life. It
has been suggested that some level of bake out should be performed after 1st
side cleaning to prevent potential problems during 2nd side reflow but the
push back is that this adds cost, handling, etc... that may introduce its
own associated problems and is not really necessary.



Thanks again. It is great to have a knowledgeable forum such as TechNet.



Joe






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