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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin D Asbell <[log in to unmask]>
Date:
Tue, 26 Sep 2006 21:05:23 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (228 lines)
(laughing, stepping on a soapbox) Yeah, and we're talking """TIN""" so no
comments on returning to the use of Lead either!!!!!!

Franklin

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hogg, Blair K.
Sent: Tuesday, September 26, 2006 7:56 PM
To: [log in to unmask]
Subject: Re: [TN] PCB Finish

Why did ENIG get brought into this thread? The original poster said he
couldn't use any nickel based fininshes. Can't you pick another thread to
bash ENIG?

________________________________

From: TechNet on behalf of Stadem, Richard D.
Sent: Tue 9/26/2006 4:39 PM
To: [log in to unmask]
Subject: Re: [TN] PCB Finish



The topic has already been discussed to death and "voted-on" in the past
within this forum and the LF forum.
Let the players decide which finish they want. They can live or die by their
choices. And they eventually will.
Weighing in, I have been involved with assembly/soldering of literally
hundreds of thousands of immersion silver pwbs used in telecommunications
equipment, medical equipment, military (non-space) equipment including
torpedoes, cruise missiles, RLG units for avionics use, flight control
computers, etc, etc, for several years now, for several different companies.
I have yet to see a reliability issue related to the McDermid IAg finish. I
have not experienced Kirkendall voiding, and hope I never do.
However, I have seen and directly experienced severe and very costly
reliability issues with ENIG (Black Pad and brittle interfacial fracture,
undetected until in the field), HASL (copper dewetting from improperly
applied HASL, undetected until attempting to solder), and ISn (severe
surface degradation leading to solderability problems). I have seen this at
OEMs and CEMs that I worked for over the years. I have used IAg with Pb-free
products, including high-volume cellphone manufacture, and it worked very
well in that application as well. It seemed to provide better wetting than
ENIG with SAC 305 paste.
My second choice would be ENEPIG. However I need to qualify this by stating
that I have only a year's experience with it, but it has been a good
experience so far. Of course, there are design and use issues that decide
what surface finish is best as well. I would not recommend anyone jump up
and run out the door to their board house screaming "Hold the press, I want
IAg", as the selection of the finish must be fully considered and fully
qualified.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Tuesday, September 26, 2006 2:45 PM
To: [log in to unmask]
Subject: Re: [TN] PCB Finish

IAg-ISn: 1-1 (half)
interesting game.
I'm on neither side, because we don't use much of either....
The IAg seems to be more aggressive and one ought to put money on them.
On the other side, ISn seems to have better coaching and more experienced
players.
I'll stay up for another hour this night to see the next half.
Inge


----- Original Message -----
From: "Franklin D Asbell" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, September 26, 2006 1:03 AM
Subject: Re: [TN] PCB Finish


>6 of one, 1/2 dozen of the other.
>
> You should consider many factors in regards to which is preferable,
> for example, shelf-life, handling, packaging, number of thermal cycles

> the product will see, surface features, size/pitch, etc.
>
> In my opinion, handling durability is better with immersion tin; shelf

> life is better with immersion tin, and solderability are equal when
> measuring the same feature types.
>
> This is comparing the Omikron with the Macdermid Sterling Silver, and,

> most important, both baths operating optimal.
>
> The Omikron bath is more difficult to maintain than the MacDermid SS
> but if I had to choose one over the other it would still be the
> Omikron. The thickness of the Omikron needs to be on the high side (30

> - 40 micro") in order to pass multiple thermal cycles, I've not seen
> silver pass as many with similar results as tin.
>
> Again, there are many factors you should consider, keep asking
> questions, talk to suppliers, customers, run DOE's, get your hands
> dirty and you will find what suits you best, this is just my opinion.
>
> Franklin
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of kwood716
> Sent: Monday, September 25, 2006 4:25 PM
> To: [log in to unmask]
> Subject: [TN] PCB Finish
>
> Hey all,
> Question...
> Is immersion silver a more reliable and all around better finish than
> white tin? I am looking into using it instead of the Omikron OA-8 we
> currently use and would like some input.
> Note: I can't use and nickel in the PCB, these boards are for MRI use
> and have to be completely non-magnetic.
> Thank you
> Ken
>
>  _____
>
>
> Saturn PCB Design, Inc.
> Kenneth J. Wood CID
> 2737 Bishop Lane
> Deltona, Fl 32725
> Phone: 407-340-2668
> email:  <mailto:[log in to unmask]> [log in to unmask]
> www.saturnpcb.com <http://www.saturnpcb.com/>
>
>
>
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