The .5% of copper allows better dissolution of a small amount of copper from the pads/leads during soldering.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
Sent: Friday, September 22, 2006 8:20 AM
To: [log in to unmask]
Subject: Re: [TN] Soldering with Sn9,5Ag3,5
Could anybody on the TechNet planet tell me the primarily reasons for using this Sn96,5Ag3,5 solder alloy?
It looks like this alloy has been already in use for some years as solder wires and solder paste for small electronic modules.
Also, I seem to remind that this was the first alloy of choice for lead-free BGA spheres before the industry consensus for SAC.
Why did the industry switch to SAC instead of SnAg? In other words, what does the copper bring?
A. Grivon
Juan T. Marugán a écrit :
> Hi,
>
> in a Class 3 product (aerospace) we have to solder some wires to a PCB
> using a Sn96,5Ag3,5 solder alloy. Wires are silver coated,
> high-strength copper alloy and the PCB is SnPb plated.
>
> My first question is, Do you consider that solder alloy as a good option?
>
> Besides, in a near future, we will change the finish of the PCB from
> SnPb to ENIG. In that situation, what solder alloy do you recommend us?
>
> Thank you in advance.
>
> Juan T. Marugán
> Production QA
> Indra Sistemas SA
> Spain
>
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