Keith, Karl, Dave,
thanks, it is very clear. Scientific explanation, exactly what I hoped for. Now I can justify filling the rework mini-wave with SN100C.
May thanks,
Ioan
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of MA/NY DDave
Sent: Sunday, September 24, 2006 1:45 AM
To: [log in to unmask]
Subject: Re: [LF] FW: [TN] Dissolving copper hole wall using lead free
HASL?
Hi Again KeithS, Karl, Ioan, IPC LF Listservers,
Forgot to add something
<So in a process like HASL, or Wave, which continually washes fresh solder
past the interface the Cu6Sn5 which is formed is washed away and more Cu is
dissolved by the Sn until the washing away stops.>
Since the solder serves a dual purpose of bring the entire component lead
and the entire board at each hole interface up to temperature we need to
keep it in the process long enough, which increases the dissolution rate
for certain hole/lead interfaces.
Yours in Engineering, Dave
YiEngr, MA/NY DDave
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