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September 2006

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 22 Sep 2006 08:26:14 -0400
Content-Type:
text/plain
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text/plain (161 lines)
Bismuth factories everywhere...heck, fight the battle a while then shoot
some ducks.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 21
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
                           

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Thursday, September 21, 2006 2:36 PM
To: [log in to unmask]
Subject: Re: [TN] Dissolving copper hole wall using lead free HASL?

Rich is right.

Just think of the outcome if RoHS had been imposed on Mr. Lincoln's
Yankee
Army.




----- Original Message -----
From: "Stadem, Richard D." <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, September 21, 2006 2:30 PM
Subject: Re: [TN] Dissolving copper hole wall using lead free HASL?


But Dewey, you don't need to worry about it or gather all that data.
Remember what DDave from NY said last week? He said that us
old-fashioned military supplier dweebs should not be opposed to using
Pb-free processes and materials, that they were just as reliable as
existing qualified processes. So c'mon, Dewey, get with it. Don't be an
old stick-in-the-mud. Something like this does not need qualification.
Just throw it out there. DDave said it would work. So what if the hole
wall might wash away from the SAC alloy? Is no big deal, eh? What else
don't we know?..... I can't wait to start build some flight control
modules for spacecraft with SAC plating on the board, and with 99% tin
finish on the component leads AND with 99% tin in the solder paste AND
with new pwb materials specially formulated to withstand blowtorch
soldering AND....darn, my keyboard just quit working. It must have
something to do with this green sticker on it.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(EHCOE)
Sent: Thursday, September 21, 2006 11:57 AM
To: [log in to unmask]
Subject: Re: [TN] Dissolving copper hole wall using lead free HASL?

That's correct. We are gathering a lot of data to support the premise
that SAC soldering of Copper PTHs is a no-no.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Thursday, September 21, 2006 9:49 AM
To: [log in to unmask]
Subject: Re: [TN] Dissolving copper hole wall using lead free HASL?

Well, it stripped out the "cut and paste" from the pdf of Jasbir's slide
at IPC.  Here is what he said on the slide:


During rework with SnAgCu alloy with copper from the PCB: copper
dissolves with increasing contact time.

Experience: PTH barrel knee erosion after  20 seconds of solder pot
dwell time

Copper dissolution is a function of  original barrel/pad thickness,
solder temperature and alloy (tin percentage),  dwell/contact time and
solder flow rate and type of copper plating.

Studies are ongoing with dissolution rate comparison with various
lead-free solder alloys and process optimization.


Denny Fritz

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