Just wondering if the users of lead free HASL were seeing a reduction of
hole wall copper thickness from copper "erosion"?  The problem of flowing  molten
SAC alloy and hole wall copper dissolution is better defined for re-work  of
through hole components using solder fountains, but I was wondering if anyone
had quantified the copper dissolution from lead-free HASL?

I will try to paste in information on copper "erosion" from the Jasbir Bath
(Solectron) paper at IPC works 10 days ago:

However, the IPC listserve may strip out this pasted in section.  So,  if you
need the whole paper, we may be able to get the Word version from  Jasbir.

Denny Fritz

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------