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September 2006

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Tue, 19 Sep 2006 12:32:22 +0200
Content-Type:
text/plain
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text/plain (58 lines)
I've seen all answers on your question. I'm surprised that ENIG has such
a low part of the total market, just some 3%, while HASL has more than
60%. See tart statistics which I send to Steve's wall. The statistics is
from McMurdy.
Inge
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dan Skweres
Sent: den 18 september 2006 23:54
To: [log in to unmask]
Subject: [TN] ENIG

We have, at times, had an outside plating service have difficulties with
plating of ENIG on our bare boards. The interesting anomaly we have
encountered is lack of plating on certain pads. They tell us there is
something on the surface of the pads but when they return the panels to
us we micro etch (copper looks beautiful) and all pads look similar in
appearance. We even took a panel and coated immersion white tin with out
problems. This tells me that there isn't any thing on the surface of the
copper. There is one thing I did leave out. The pads that aren't taking
ENIG all happen to be in the same net. Has anyone encountered this? It's
almost like there is a charge being created in certain nets not allowing
the ion exchange to happen. Could it be entrapped chemistry within vias?
Any help and/or direction would be greatly appreciated.
Thanks,
 
 
Dan Skweres
Engineering Manager
Bartlett Manufacturing
Phone:847-639-2102 Ext.#230
Fax:847-639-8838


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