I've found that thoroughly developing the soldermask out of
the vias helps avoid this ENIG problem.

Thank you,
Eddie Rocha



We have, at times, had an outside plating service have
difficulties with plating of ENIG on our bare boards. The
interesting anomaly we have encountered is lack of plating
on certain pads. They tell us there is something on the
surface of the pads but when they return the panels to us
we micro etch (copper looks beautiful) and all pads look
similar in appearance. We even took a panel and coated
immersion white tin with out problems. This tells me that
there isn't any thing on the surface of the copper. There
is one thing I did leave out. The pads that aren't taking
ENIG all happen to be in the same net. Has anyone
encountered this? It's almost like there is a charge being
created in certain nets not allowing the ion exchange to
happen. Could it be entrapped chemistry within vias? Any
help and/or direction would be greatly appreciated.
Thanks,


Dan Skweres
Engineering Manager
Bartlett Manufacturing
Phone:847-639-2102 Ext.#230
Fax:847-639-8838


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