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September 2006

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Mon, 18 Sep 2006 11:04:22 -0500
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Rumor has it that Intel had collected some data showing the effects of
moisture absorption in laminates and the major issues it caused,
especially in high impedance circuitry. 

That work may have been done by a Mr. Paul Hamilton / @ Intel. 

I would appreciate any details on publications that may have come out on
that topic or contact information for Paul.

Thanks.  

Rich K KEDS

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