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September 2006

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Subject:
Re: Filled Vias
From:
Stephen Pierce <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stephen Pierce <[log in to unmask]>
Date:
Fri, 15 Sep 2006 15:54:23 -0700
Content-Type:
text/plain
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text/plain (28 lines) 
Kim,

Generally speaking, I would recommend non-conductive fill materials if you
don't specifically require conductivity...much easier to process and
significantly less expensive.

Stephen

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kim Haynes
Sent: Friday, September 15, 2006 3:12 PM
To: [log in to unmask]
Subject: [TN] Filled Vias

I was wondering if anyone had some data comparing conductive via fills
versus non-conductive via fills.  I am especially interested in any
comparison on reliability issues.

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