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September 2006

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Subject:
From:
Rudolph yu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Rudolph yu <[log in to unmask]>
Date:
Fri, 15 Sep 2006 18:21:51 +0000
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Recently I asked an outside lab to perform the dye & pry test on couple
failure assemblies. The heatsink was not removed from the PBGA prior to the
dye application.

According to  the result and pictures,  the corner pads of the BGA package
from both units were covered by the dye completely .  An indication that a
seperation was formed between the BGA package's pads and its original solder
balls at that one corner after the SMT process.

Have anyone of you experienced this kind of defects in the past and what
could be the root cause of this phenomena?  ( Poor plating from  the IC
manufacturer? SMT reflow profile? PCB warpage? )

I have been in the industry for 10 years and have never seen thing like
this.  Is it common??

Thanks
Ryu

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