In a message dated 9/5/06 0:45:08, [log in to unmask] writes:
> Is there a standard that defines a minimum pull force requirement after the
> component has been soldered. 
> A: No, there is no such standard. A properly wetted solder joint is stronger 
than the attachment of the soldering pads to the PCB/component resin matrix.

> The issue is, to get a better joint we had introduced extra solder to the 
> component (confirms to IPC-610D). 
> A: Why do you think that more solder will give you a "better joint"? What 
does better mean?

> Do we have a minimum pull force value which can be adopted so
> that we can give assurance to customer that there will be no issue with
> joints.
> A: Solder joint issues come from either low quality—meaning inadequate 
metalurgical bond due to insufficient wetting; or from creep-fatigue which is not 
very dependent on solder joint volume. So, you are reallly asking the wrong 
question.

Werner

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