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September 2006

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Wed, 13 Sep 2006 10:06:46 -0400
Content-Type:
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text/plain (46 lines)
Hot air and a vacuum tip.  And flux.  It will go down much nicer the
second time since the part has been tinned.  The flux should keep the
distributions pretty even.  If the device has a large pad in the middle
beneath it, then make sure you don't have too much solder on the pad
you're placing it on or the peripheral leads won't touch.

Wayne Thayer

>>> [log in to unmask] 9/13/2006 8:24 am >>>
Hi Technos,

how do you rework leadless components? Or detailed: how do you remove
them and how do you solder them back, in a repetitive and successful
manner?

Thanks,

Ioan

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