The requirement being questioned reads:

BARE BOARD CLEANLINESS MUST BE VERIFIED BEFORE AND AFTER APPLICATION OF
SOLDER MASK USING AN OMEGA METER 600 SMD OR EQUIVALENT HEATED IONOGRAPH.
MAXIMUM CONTAMINATION SHALL NOT EXCEED 0.47ug/cm2 NaCl.

Would you expect ENIG to be at 0.6 while HASL was at 0.8, for example? I
thought there would be a final cleaning that would cause the end result to
be pretty much the same, regardless.

As is obvious, I don't really know squat about this sort of thing, and am
relying on the kindness of strangers.... (hello Dewy)

Thanks,
-Chris




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                                                         Subject:    Re: [TN] bareboard cleanliness related to
                       09/12/2006 02:36 PM                 surface finish
                       Please respond to TechNet
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                       respond to Wgkenyon2







You might wish to compare ionics, which might not be much different.
However, if you compared non-ionics using TMs 2.3.38 or 2.3.39, you might
find  quite
a difference.

Bill  Kenyon
Global Centre Consulting
3336 Birmingham Drive
Fort Collins, CO  80526
Tel: 970.207.9586 Cell: 970.980.6373
email:  [log in to unmask]


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