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September 2006

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Subject:
Re: Lower temp soldering pass of lead-free boards
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:
Mon, 18 Sep 2006 14:17:43 -0400
Content-Type:
text/plain
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text/plain (56 lines) 
Graham,

seeing everything that happens lately with the supply chain, I agree I might have to look into vapour-phase, generally speaking. Would you point me towards a few suppliers of this kind of equipment?

OK Werner, I won't risk.

Thanks,

Ioan


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Graham Naisbitt
Sent: Monday, September 18, 2006 1:31 PM
To: [log in to unmask]
Subject: Re: [TN] Lower temp soldering pass of lead-free boards


Ioan

I can suggest that you could try vapour-phase soldering. You would
use 2 different boiling-point fluids 220 or 230 for the lead-free and
200 for the tin/lead. It has worked OK in trials we have done but I
cannot attest to the quality/reliability of the solder joint - yet!

Kindest regards
Graham Naisbitt

[log in to unmask]

www.gen3systems.com

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


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