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September 2006

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From:
"Macko, Joe @ IEC" <[log in to unmask]>
Date:
Wed, 6 Sep 2006 09:31:10 -0700
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TechNet E-Mail Forum <[log in to unmask]>, "Macko, Joe @ IEC" <[log in to unmask]>
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Fellow techs,



Hello.

A general question came up about the need to re-bake a double sided board
after 1st side reflow/DI wash before starting 2nd side assembly. The concern
is that the board (or mounted MSDs) may absorb enough moisture going through
the high-pressure DI water in-line cleaner to potentially cause a problem
during 2nd side reflow. There are some MSDs mounted on the 1st side but both
sides are assembled before exceeding any of the component's floor life. It
has been suggested that some level of bake out should be performed after 1st
side cleaning to prevent potential problems during 2nd side reflow but the
push back is that this adds cost, handling, etc... that may introduce its
own associated problems and is not really necessary.



Thanks again. It is great to have a knowledgeable forum such as TechNet.



Joe






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