Dear Technets,

Is there a standard that defines a minimum pull force requirement after the
component has been soldered. The issue is, to get a better joint we had
introduced extra solder to the component(confirms to IPC-610D). The
component in question is a SMT type lug which is hand soldered. The
customer tells that excess solder on the lugs would cause the pad peel off
in the field. Do we have a minimum pull force value which can be adopted so
that we can give assurance to customer that there will be no issue with
joints.

Advance thanks for the help.

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