Does anybody have any background on silver filled vias and its suitability for Lead Free Assembly?  There are warnings in the literature about heat excursions, and it seems that lead free assembly would make this worse.  I found only one email in the archives about delamination associated with filled vias, but never found any answers as to wether the filled vias were the cause, and/or what to do about it.

Any insights are appreciated.

thanks


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Ralph