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August 2006

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 11 Aug 2006 20:57:29 -0400
Content-Type:
text/plain
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Hi Amol,
Thicker/denser [Alpha Level?] ImAg will protect the solderability of
the underlying Cu with greater assurance, thinner ImAg will provide
greater assurance that silver embrittlement will not occur.

Werner

-----Original Message-----
From: [log in to unmask]
To: [log in to unmask]
Sent: Fri, 11 Aug 2006 1:09 PM
Subject: Re: [TN] silver embrittlement

   Hi,
What are the important advantages/disadvantages between Thin/Thick
Immersion Ag
Coatings? The difference in specs is 12uins. Are there any particular
applications where thin silver is preferred over thick and vice versa?

Thanks,
Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc.
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
www.harvardgrp.com

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of George Milad
Sent:   Friday, August 11, 2006 12:17 PM
To:     [log in to unmask]
Subject:        Re: [TN] silver embrittlement

Sue,

You have every right to be confused, as the chairman of the plating
committee that put out the specification 4553, I have gone back and
re-read the
specs. The specs refer to thin silver and thick silver.

My apologies for the poor choice of terminology, the intent was to
differentiate between the Alpha Level product which could only produce
a very
thin
coating and the rest of the Immersion silvers out there that could
produce  a
thicker coating. So "thin" is a spec for Alpha level only and the
"thick" is
the
spec for all other immersion silvers.

For users not specifying Alpha Level the spec is:
5 uins minimum, typical 8uins-12uins.
Thick silver would be silver at 20uins or higher.

Thicker silver is unnecessary and may give rise to compromised solder
joint
strength. I am not sure that embrittlement is the main defect here,
after  all
the Pb/free SAC 305 alloy contains  3% silver.


George Milad
(Chairman IPC  Plating  Committee)
National Accounts Manager for  Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874

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