Hi George,

Thanks for your reply and the updated information.  I'm going to send this
to my board manufacturer and get their input, too.  Much appreciated.
Looks like I'm probably going to be changing my fab spec.

Sue


-----Original Message-----

Date:         Fri, 11 Aug 2006 12:17:29 EDT
Reply-To:     TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Sender:       TechNet <[log in to unmask]>
From:         George Milad <[log in to unmask]>
Subject:      Re: silver embrittlement
X-To:         [log in to unmask]
Content-Type: text/plain; charset="US-ASCII"



Sue,

You have every right to be confused, as the chairman of the plating
committee that put out the specification 4553, I have gone back and re-read
the specs. The specs refer to thin silver and thick silver.

My apologies for the poor choice of terminology, the intent was to
differentiate between the Alpha Level product which could only produce a
very  thin coating and the rest of the Immersion silvers out there that
could produce  a thicker coating. So "thin" is a spec for Alpha level only
and the "thick" is  the spec for all other immersion silvers.

For users not specifying Alpha Level the spec is:
5 uins minimum, typical 8uins-12uins.
Thick silver would be silver at 20uins or higher.

Thicker silver is unnecessary and may give rise to compromised solder
joint strength. I am not sure that embrittlement is the main defect here,
after  all the Pb/free SAC 305 alloy contains  3% silver.

George Milad
(Chairman IPC  Plating  Committee)
National Accounts Manager for  Technology
Uyemura International Corp (UIC)
249 Town Line Rd
Southington CT 06489
[log in to unmask]
Cell: (516) 901  3874


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