Hi To Everyone,

Are any of you familiar with the MPM AP25? We have two of them that we have been running for some time. We have just started to build a board that contains a BGA with a ball size of .016" (0.4mm). Before starting production of this board, I asked MPM if the 2D inspection system of my AP25's would be able to handle this diameter and was told that the vision system of my particular units could go as low as .010" (0.25mm). However, when I try to teach the machine the ball size and the layout of the BGA, it comes up with a pad contrast error. Unfortunately for me, this model was obsoleted in early July and Speedline (MPM) no longer offers support, so I can't ask them for more help.

Is there anyone out there that might be familiar with this problem?

TIA,
Paul Black 
Manufacturing Engineer 
Kronos 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------