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August 2006

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Subject:
From:
Gloria Brown <[log in to unmask]>
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Date:
Fri, 11 Aug 2006 07:13:21 -0500
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The standard that covers moisture sensitive devices and baking is J-STD-033.

Gloria Brown
phone 906-932-5970  ext. 26
fax  906-932-9822
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Badri
Sent: Thursday, August 10, 2006 11:01 PM
To: [log in to unmask]
Subject: [TN] dross generation

Dear All,

May be a basic question. Seeking everyones help in understanding.
Moisture sensitive devices are baked before reflow. why and what will be the
impact.
After board assembly what is the impact of moisture on the components.
Is there a standard available that specifies the right method of baking.

Advance thanx for the help you are rendering me.

Thanx
Badri

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