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August 2006

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Subject:
dross generation
From:
Badri <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Badri <[log in to unmask]>
Date:
Fri, 11 Aug 2006 09:30:58 +0530
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines) 
Dear All,

May be a basic question. Seeking everyones help in understanding.
Moisture sensitive devices are baked before reflow. why and what will be the
impact.
After board assembly what is the impact of moisture on the components.
Is there a standard available that specifies the right method of baking.

Advance thanx for the help you are rendering me.

Thanx
Badri

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