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August 2006

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Subject:
Re: Barrel to Laminate Adhesion loss
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Tue, 1 Aug 2006 10:52:21 -0400
Content-Type:
text/plain
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text/plain (60 lines) 
Recently we have been seeing hole wall pull away associated with some of the "lead free" materials exposed to thermal excursions  to "tin lead" assembly temperatures.  

The most recent "hole wall pull away" has been significant, and, in the worst instances, caused post separation.


Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
[log in to unmask] <mailto:[log in to unmask]> 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: Tuesday, August 01, 2006 9:46 AM
To: [log in to unmask]
Subject: [TN] Barrel to Laminate Adhesion loss


Esteemed Tech-net,
What are the causes of Barrel to Laminate Adhesion loss?

TIA,
Kerry

Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
50 Rosemont Road
Westwood, MA 02090-2306

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