I concur with Brian's comments adding only that my experience is that
concerns of burrs diminish with reduction in the thickness of the  foil.

This topic took me back in time. I worked out a method for  electrochemical
deburring of PCBs many years ago when at Boeing. I have long  lost the note
books and papers on the topic but the patent (US 4,482,445 now expired) shows
what was possible.

Kind regards,
Joe

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