We are experiencing fractured solder joints in our manufacturing
process. We know it is caused from the lead trimming we are doing. We do
not have automated equipment that will cut and clinch the leads.

 I wanted to reflow the boards a second time until we get our process
under control but not everyone agrees with that. They are afraid of
damage to the components caused by the heat of the reflow. Has anyone
else experienced this issue before and what did you temporarily do to
alleviate the problem while working on the real issue of the lead
cutting process. I have tried visual inspection but these boards are
dense boards and we missed some joints and they were returned to us
again by our Customer.

IPC 610 section 7.5.5.8 states you may reflow and it is not considered
rework. However they mention nothing about reliability if we do this.

Thanks
Sue Runals
QA Mgr.

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