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| Date: | Fri, 4 Aug 2006 13:15:59 EDT |
| Content-Type: | text/plain |
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Hi Rod,
You are misinterpreting what I wrote, anchoring the barrel walls is always a
good thing—for thin PCBs it may not be needed.
Teardrop or filet transitions from annular ring to trace is also a good
thing.
I will send the info on the White Paper by separate mail.
Werner
In a message dated 8/3/06 11:08:10, [log in to unmask] writes:
> So Anchoring barrel wall is not recommended on higher Tg/Td laminate
> systems due to Cu CTE...
>
> Could I get a copy of that White paper? I'm interested in the cause
> effect also...
>
> We have seen similare problems arise from trace/pad interface and
> fracturing. If what you say is good for Barrel, this may also have
> limits that are being exceeded. Our conventional wisdom is to teardrop
> or filet the interface from Annular ring to Trace, to help with the
> migration of a mechanical fracture.
>
> Will this logic still apply?
>
> LoHst and Confused...
>
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