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Subject:	Re: LLP (Leadless Leadframe Package) headaches...
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:	Thu, 31 Aug 2006 15:06:17 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (17 lines)

Hi Steve,
You do not say what the lead material is; if it is Alloy 42 and the others
are Cu than what you describe is natural if your profile as just o.k. for
soldering to Co, but too low for soldering to Ni.

Werner

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