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August 2006

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Subject:
From:
Ivanoe Pedruzzi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ivanoe Pedruzzi <[log in to unmask]>
Date:
Thu, 31 Aug 2006 15:52:31 +0200
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*This message was transferred with a trial version of CommuniGate(r) Pro*
Well,
I guess that the same sort of cooling the pot down a bit to let the
formation of the copper IMC might work as well for the L-F alloys.

However, being the alloys less dense, the IMC may form on the bottom
of the solder pot, instead on the surface.
I imagine one should dig into the molten pot a little rake, or
something alike,  and try to fetch them.

By the way, isn't there alloys made specifically up to balance the
solder in the pot?
I'm thinking of SAC300 or SN100CLe and Sn100CLe+,  for example.

Ivan

Il giorno 31/ago/06, alle ore 15:39, Werner Engelmaier ha scritto:

> *This message was transferred with a trial version of CommuniGate
> (r) Pro*
> *This message was transferred with a trial version of CommuniGate
> (r) Pro*
> Hi Mike,
> I do not know of one either, and I think the much reduced density
> of SAC
> solders, in the absence of Pb, makes such a process unlikely.
>
> Werner
>
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