Paul, the committee updated the terminals soldering section to align to
IPC-A-610D and J-STD-001D terminal soldering criteria, including support
for lead free connections.

A new chapter was added that addresses electrical and mechanical
testing.

The molding/potting chapter was significantly expanded, lots of new
pictures and criteria.

The splicing section was significantly expanded with criteria for
heat-shrinkable solder splices added.

Numerous tweaks on verbage for clarification/ease of understanding. The
revision was nearly five years in development (originally published Jan
2002) and industry provided good comments for this revision.

Jack Crawford
IPC director certification and assembly technology

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stolar, Paul W
Sent: Tuesday, August 01, 2006 3:39 PM
To: [log in to unmask]
Subject: [TN] IPC-620

I just found out that the IPC/WHMA-A-620 was just revised.

Does anyone know what they changed?

Paul Stolar
Materials/Reliability Engineer
Manufacturing Reliability Lead Engineer
Baker Atlas
713-625-5376
713-625-4949 (fax)

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