Kerry,
You have gotten a lot of good direction, from a mechanical standpoint,
you might check the following.
If Multilayer, are you putting some non-functional pads in to allow for
some Anchoring of the plating to the prepreg system? If you are, is the
PCB house removing them?
What type of Glass are you calling out in the system, or are you leaving
it to the PCB house to decide?
What clearance are you providing and allowing for Cu plating... I have
received art in past that won't allow for the 2oz the customer specified
on a HASL plated PCB, maybe look to a different solder finish if this is
root.
My 2RMB
Rodney L. Miller
Tri-onics Inc
Highland / Shanghai
Integrity and Solutions for Electronic Outsourcing
-----Original Message-----
From: Barmuta, Mike [mailto:[log in to unmask]]
Sent: Tuesday, August 01, 2006 9:59 AM
Subject: Re: Barrel to Laminate Adhesion loss
Hi Kerry: There's a list a mile long that can cause hole wall adhesion.
Typically it is in the steps for hole clean/prep/condition/catalization
prior to electroless copper. If not done correctly the interfacial
bonding of the electroless to the hole wall can be weak and will
subsequently pull away when stressed. However that is simply a guess as
to the cause of your problem.
To try and narrow it down can you supply some additional information:
You may or may not have this information but without it whatever
responses you get will only be speculation and may lead you in the wrong
direction.
* Are these multilayer boards, how many layers?
* If they are multilayer what is the desmear process?
* Are they built with electrloess copper if not what?
* What is the electroplated copper thickness in the hole?
* Do you have cross sections to look at, can you furnish pictures?
* What is actually separating is it the copper (electroless or
electroplated) from the hole wall, is it separating from the entire hole
wall, just the laminate, the inner connect, etc?
* Where in the assembly process is it happening?
Regards
Michael Barmuta
Staff Engineer
Fluke Corp.
Everett WA
425-446-6076
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerry McMullen
Sent: Tuesday, August 01, 2006 6:57 AM
To: [log in to unmask]
Subject: Re: [TN] Barrel to Laminate Adhesion loss
170 Tg FR4
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
50 Rosemont Road
Westwood, MA 02090-2306
(T) 781-467-5468
Franklin D Asbell <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
08/01/2006 09:52 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to Franklin D
Asbell <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Barrel to Laminate Adhesion loss
Could be a few causes, at what stage are you seeing this?
1 - As Received condition?
2 - After Thermal Stress?
3 - After Assembly?
Some common causes could be;
1 - Poor drilling (resulting in excessive resin smear or damaged hole
wall)
2 - Poor resin smear removal
3 - Poor pre-electroless copper cleaning-prep
4 - Poor electroless copper plating
5 - Material type (are you using some exotic material)
Would you provide more info.
Franklin
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kerry McMullen
Sent: Tuesday, August 01, 2006 8:46 AM
To: [log in to unmask]
Subject: [TN] Barrel to Laminate Adhesion loss
Esteemed Tech-net,
What are the causes of Barrel to Laminate Adhesion loss?
TIA,
Kerry
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
50 Rosemont Road
Westwood, MA 02090-2306
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