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August 2006

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Subject:
From:
"P. Langeveld" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, P. Langeveld
Date:
Fri, 18 Aug 2006 18:24:44 +0200
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text/plain
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Dear Michael,
Adagium: Dross makes Dross.
So frequently remove the dross from the surface of the solder bath.
And reduce if possible, the distance between the solder wave and the
solder surface in the solder pot so there is less turbulance where the
solder falls back in the pot.

Regards,  Peer Langeveld
Consultant Soft Soldering Processes
5502 VH 8  The Netherlands



2006/8/9, Miguel Vallejo <[log in to unmask]>:
> Hi guys,
>
> Can any one share your experience with the increase amount of dross
> production from your lead-free wave operation?
>
> I'm using SN100C alloy on an air atmosphere. I'm seeing 84% of the solder
> used turning to dross (6.2:1 efficiency ratio).
>
> In my study, I weighted the loaded board prior to and after wave solder to
> determine the amount of solder on each PCBA, and compared the amount of
> solder used to replenish the pot with the aggregate amount of solder
> required on 15K units. The difference correlates with the amount of dross
> produced.
>
>
>
> I'd like to understand how much of this increase is attributed to the
> lead-free technology and how much to the equipment performance.
>
>
>
> Thanks for your help.
>
>
>
> Miguel Vallejo
>
> Mfr Engineer
>
>
>
>
>
>
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