Yes, you should worry. The gold plating will be thin and porous, as well 
as dissolving instantaneously, and P-bronze is just one helluva alloy to 
solder. In fract, all bronzes can be difficult but phosphor-bronze 
particularly so. It would be necessary to have a thick barrier metal, 
say 5 µm nickel, overlaid by ~3 µm gold for P-bronze, IMHO.

Brian

Tempea, Ioan wrote:
> Hi Technos,
> 
> if we're talking dissolution and all the big guns are here, I have a question:
> 
> should I worry about the solderability of Au plated, phosphor bronze pins?
> 
> I mean the bronze is CuSn, and it should have no dissolution issue so this connector should practically solder as good as the MLCCs. In no circumstance should this part solder harder than a QFP, for instance. The only issue might be the gold plating. Am I right?
> 
> Thanks,
> 
> Ioan
> 
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