" By the way, such kind of issue happened only to one customer..." see
my comments to 'Immersion Au vs Immersion Ag'..Poh's case is typically
what I meant: supplier dependency.
Richard's words about a dewetting caused by a phosphorous rich barrier
is also what I think. Therefore, KH, send your sample(s) to a qualified
lab for confirmation of what Richard proposed. And, if you have accepted
results from other board suppliers, then be happy, and skip the bad one
until they show improvements.
Inge
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Poh Kong Hui
Sent: den 17 augusti 2006 16:24
To: [log in to unmask]
Subject: Re: [TN] LEADFREE BGA ISSUE
Hi Technetters,
Could someone advise me the reasons to following issue.
1. There are total 25 boards for the evaluation purpose.
2. Round 1, we assemble d11 units SAC BGA onto board of ENIG. The
result
was 10 passed functioonal, 1 piece was not working. There was no signal
& power to the BGA unit.
3. Round 2, 4 boards were being assembled, 3 passed, 1 was not
working
4. Round 3, 10 boards were biring assembled, 1 was working, 9 not
working.
The above-stated boards undergo the same temperature profile.
At the beginning, we were suspecting the board of ENIG. When 1 BGA was
being removed from the failed board, and intend to perform the
reballing, we realise the not all BGA substrate pads were able to
solder. Certain pads were very dull and when solder is applied on it, it
seened there was dewetting issue.
My question is, if the failure of the BGA that was due to BGA's
substrate or otherwise.
By the way, such kind of issue happened only to one customer...
Thanks
KH Poh
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