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August 2006

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
Date:
Thu, 17 Aug 2006 14:54:13 -0400
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Ah, but which way does Glovie point?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard D.
Sent: Thursday, August 17, 2006 2:21 PM
To: [log in to unmask]
Subject: Re: [TN] LEADFREE BGA ISSUE


I am assuming Poh means the problem is the ENIG finish on the BGA pads.
Same thing, whether the board or the BGA pads.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tempea, Ioan
Sent: Thursday, August 17, 2006 1:04 PM
To: [log in to unmask]
Subject: Re: [TN] LEADFREE BGA ISSUE

I think that Poh is talking about non-solderable pads on the component,
not on the PCB. Am I right?

In this case, the component manufacturer has to be involved. Send a
couple of bad parts for a failure analysis and you will know where the
problem is.

In case I am wrong and the PCB is in question, Poh got very adequate
answers already.

Regards,

Ioan

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Poh Kong Hui
Sent: 17 August 2006 15:24
To: [log in to unmask]
Subject: Re: [TN] LEADFREE BGA ISSUE

Hi Technetters,
Could someone advise me the reasons to following issue.

1.      There are total 25 boards for the evaluation purpose.
2.      Round 1, we assemble d11 units SAC BGA onto board of ENIG. The
result
was 10 passed functioonal, 1 piece was not working. There was no signal
& power to the BGA unit.

3.      Round 2,  4 boards were being assembled, 3 passed, 1 was not
working

4.      Round 3, 10 boards were biring assembled, 1 was working, 9 not
working.

The above-stated boards undergo the same temperature profile.

At the beginning, we were suspecting the board of ENIG. When 1 BGA was
being removed from the failed board, and intend to perform the
reballing, we realise the not all BGA substrate pads were able to
solder. Certain pads were very dull and when solder is applied on it, it
seened there was dewetting issue.

My question is, if the failure of the BGA that was due to BGA's
substrate or otherwise.

By the way, such kind of issue happened only to one customer...
Thanks

KH Poh

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