<Certain pads were very dull and when solder is applied on it, it seened
there was dewetting issue>
Sounds like an issue with the solderability of the ENIG rather than the
substrate. Check with your PCB fab supplier for their comments.
<By the way, such kind of issue happened only to one customer...>
It only takes one instance of poor process control on ENIG to see faults
occurring. Looks like this is what has happened in this case.
Rgds
Colin
Colin McVean M.Inst.C.T.
Production Manager
Artetch Circuits Limited
Main: 01903 725365
DD: 01903 712926
Email: [log in to unmask]
www.artetch.co.uk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Poh Kong Hui
Sent: 17 August 2006 15:24
To: [log in to unmask]
Subject: Re: [TN] LEADFREE BGA ISSUE
Hi Technetters,
Could someone advise me the reasons to following issue.
1. There are total 25 boards for the evaluation purpose.
2. Round 1, we assemble d11 units SAC BGA onto board of ENIG. The
result
was 10 passed functioonal, 1 piece was not working. There was no signal
&
power to the BGA unit.
3. Round 2, 4 boards were being assembled, 3 passed, 1 was not
working
4. Round 3, 10 boards were biring assembled, 1 was working, 9 not
working.
The above-stated boards undergo the same temperature profile.
At the beginning, we were suspecting the board of ENIG. When 1 BGA was
being removed from the failed board, and intend to perform the
reballing,
we realise the not all BGA substrate pads were able to solder. Certain
pads
were very dull and when solder is applied on it, it seened there was
dewetting issue.
My question is, if the failure of the BGA that was due to BGA's
substrate
or otherwise.
By the way, such kind of issue happened only to one customer...
Thanks
KH Poh
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