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August 2006

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From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Tue, 15 Aug 2006 11:04:49 -0700
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To review, what I have discussed perhaps too many times...

  When you plate metals, you transfer electrons to the ions in solution, turning the ions into metal.
  There are three kinds of plating from an electrolyte, Electrolytic, Electroless and Immersion... they differ primarily in where the electrons which cause plating come from.

  In Electrolytic, the electrons are "pumped" from the anode to the work by the rectifier.

  In Electroless, the electrons are supplied by another chemical in the electrolyte, like Formaldehyde (electroless Copper) or Hypophosphite (Electroless Nickel).

  In Immersion plating, the electrons are supplied by the substrate (usually Copper in our world) as it goes into solution.

  In general, any immersion plating bath is easier to maintain/control and thus get good plating from, than an electroless plating bath, as there is so much less to worry about.

  So ENIG, although it may give a superior finish, when done right, is one difficult bath to have work correctly, and frankly, my hat is off to those of you who have mastered this process, I am glad I do not have to do this....and make money from the process too.

  Think of it this way, it is possible to walk away from most immersion baths, for days, return, turn on the heat, and plate.... this is rarely the case with an electroless bath.

  Rudy Sedlak
  RD Chemical Company




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