Thank you, Paul.
Has anyone else seen problems associated with hole wall pull away or
other issues with Tg170 substrates? Kerry, what material were you using
when you experienced this problem?
A question for Werner and Susan Hott: are the properties of the newer
pwbs with higher Tgs something that would cause more lateral stresses
that would contribute to hole wall separation, or for that matter trace
separation?
-----Original Message-----
From: Paul Reid [mailto:[log in to unmask]]
Sent: Tuesday, August 01, 2006 5:29 PM
To: TechNet E-Mail Forum; Stadem, Richard D.
Subject: RE: [TN] Barrel to Laminate Adhesion loss
Yes Richard,
Your eyes are good, you read it correctly, and, surprisingly, I typed
correctly.
Some new materials may be resistant to delamination and robust for
reliability at lead-free temperatures but exhibit pull away even at
tin/lead, 230C, assembly temperatures.
Werner points out you have to do your homework on lead-free application.
Some of failure modes we are seeing are counter-intuitive.
We are seeing more delamination, knee cracks and hole wall pull away
lately. Some of this is due to the higher temperatures of lead-free,
some appears to relate to new materials.
Paul
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard D.
Sent: Tuesday, August 01, 2006 11:07 AM
To: [log in to unmask]
Subject: Re: [TN] Barrel to Laminate Adhesion loss
Did I read that right? At lower temperatures used for soldering 63/37
solder, you are getting hole wall pullaway on pwbs that are meant for
much higher lead-free process temps? Then I assume the problem would be
much worse if you had soldered at higher temps?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: Tuesday, August 01, 2006 9:52 AM
To: [log in to unmask]
Subject: Re: [TN] Barrel to Laminate Adhesion loss
Recently we have been seeing hole wall pull away associated with some of
the "lead free" materials exposed to thermal excursions to "tin lead"
assembly temperatures.
The most recent "hole wall pull away" has been significant, and, in the
worst instances, caused post separation.
Sincerely,
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1
613 596 4244 ext. 229
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: Tuesday, August 01, 2006 9:46 AM
To: [log in to unmask]
Subject: [TN] Barrel to Laminate Adhesion loss
Esteemed Tech-net,
What are the causes of Barrel to Laminate Adhesion loss?
TIA,
Kerry
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
50 Rosemont Road
Westwood, MA 02090-2306
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