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August 2006

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Subject:
From:
Paul Reid <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Reid <[log in to unmask]>
Date:
Tue, 1 Aug 2006 18:29:04 -0400
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text/plain (122 lines)
Yes Richard,

Your eyes are good, you read it correctly, and, surprisingly, I typed correctly. 

Some new materials may be resistant to delamination and robust for reliability at lead-free temperatures but exhibit pull away even at tin/lead, 230C, assembly temperatures.  

Werner points out you have to do your homework on lead-free application.  Some of failure modes we are seeing are counter-intuitive. 

We are seeing more delamination, knee cracks and hole wall pull away lately. Some of this is due to the higher temperatures of lead-free, some appears to relate to new materials.


Paul



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard D.
Sent: Tuesday, August 01, 2006 11:07 AM
To: [log in to unmask]
Subject: Re: [TN] Barrel to Laminate Adhesion loss


Did I read that right? At lower temperatures used for soldering 63/37
solder, you are getting hole wall pullaway on pwbs that are meant for
much higher lead-free process temps? Then I assume the problem would be
much worse if you had soldered at higher temps? 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: Tuesday, August 01, 2006 9:52 AM
To: [log in to unmask]
Subject: Re: [TN] Barrel to Laminate Adhesion loss

Recently we have been seeing hole wall pull away associated with some of
the "lead free" materials exposed to thermal excursions  to "tin lead"
assembly temperatures.  

The most recent "hole wall pull away" has been significant, and, in the
worst instances, caused post separation.


Sincerely,

Paul Reid

Program Coordinator

PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1

613 596 4244 ext. 229
[log in to unmask] <mailto:[log in to unmask]> 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: Tuesday, August 01, 2006 9:46 AM
To: [log in to unmask]
Subject: [TN] Barrel to Laminate Adhesion loss


Esteemed Tech-net,
What are the causes of Barrel to Laminate Adhesion loss?

TIA,
Kerry

Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
50 Rosemont Road
Westwood, MA 02090-2306

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