TECHNET Archives

August 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
X-To:
TechNet E-Mail Forum <[log in to unmask]>
Date:
Fri, 18 Aug 2006 09:26:22 -0400
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, "Tempea, Ioan" <[log in to unmask]>
Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Content-Transfer-Encoding:
quoted-printable
In-Reply-To:
Content-Type:
text/plain; charset="iso-8859-1"
MIME-Version:
1.0
Parts/Attachments:
text/plain (22 lines)
Hi Technos,

if we're talking dissolution and all the big guns are here, I have a question:

should I worry about the solderability of Au plated, phosphor bronze pins?

I mean the bronze is CuSn, and it should have no dissolution issue so this connector should practically solder as good as the MLCCs. In no circumstance should this part solder harder than a QFP, for instance. The only issue might be the gold plating. Am I right?

Thanks,

Ioan

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2