Amol,
Could you precise what are the BGA and PCB characteristics, as well as
the PCB base material used?
Best regards,
A. Grivon
Kane, Amol (349) a écrit :
> Dear Technetters,
> We are having instances where copper pads (Under BGAs) are being lifted off ENIG Boards almost too easily during rework. We use the same thermal profile on each board (for the same component removal) and only some show this phenomenon. Is there a test or standard to test the copper adhesion @ incoming to see whether it's the fab (i.e. are the boards coming to us with poor copper adhesion strength to being with) or the process that's doing this. The board is heated upto 120 C when the component is reflowed for removal. Also, is there data to show the decrease in Cu adhesion strength with temp?
>
> Thanks,
>
> Amol Kane
> M.S (Industrial Eng.)
> Process Engineer
> Harvard Custom Manufacturing, Inc.
> 941 Route 38 Owego, NY 13827
> Phone: (607) 687-7669 x349
> [log in to unmask]
> www.harvardgrp.com
>
>
>
>
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