Dear Technetters,
We are having instances where copper pads (Under BGAs) are being lifted off ENIG Boards almost too easily during rework. We use the same thermal profile on each board (for the same component removal) and only some show this phenomenon. Is there a test or standard to test the copper adhesion @ incoming to see whether it's the fab (i.e. are the boards coming to us with poor copper adhesion strength to being with) or the process that's doing this. The board is heated upto 120 C when the component is reflowed for removal. Also, is there data to show the decrease in Cu adhesion strength with temp?

Thanks,

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing, Inc. 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]
www.harvardgrp.com




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