The Technical Adaption Committee of the EU has recently approved a
exemption for lead finishhes on lead frames with under 0.65 mm pitch.  The
product description excerpted below makes clear that millions of
integrated circuits will be exempted.  So how will anyone be able to test
for lead content at the equipment level?

Flip chips have already been exempted.  They contribute even more lead,
potentially.

Some have said that competitive pressures will be effective in enforcing
compliance. I don't agree. Company X will be reluctant to blow the whistle
on Company Y.  It might go around at some point in time.  No-one will want
to foreclose future options in the face of the many reliability questions
with lead-free.  Those reliability questions are the reasons for the
exemptions. Cross out that word, "questions"-- "realities" is a better
word.

And to Senator Simitian, do the California legislators really want to
follow Europe into the enforcement morass and create a law that invites
violations, because it is so unreasonable and unenforceable?  I should
add, anti-environmental, as well.  Please call me for the many
reasons--650-630-1192.

"STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for
applications requiring a thin profile. TSSOP is a leadframe based, plastic
encapsulated package with gull wing shaped leads on two sides with lead
count ranging from 8 to 56 leads. The ultra thin TSSOP is made possible by
optimal wire looping control during the wire bonding process as well as
optimal package warpage control during the molding process. TSSOP is
designed to fill the niche of low pin count devices where low profile and
small footprint are key design considerations. The TSSOP features 0.5 and
0.65mm lead pitch, and is ideal for low pin count analog and mixed signal
devices in handheld applications such as PDAs and mobile / cellular phones"

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