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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 9 Aug 2006 13:29:19 -0400 |
Content-Type: | text/plain |
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Hi Netters,
I am wondering if the last months shed more light on how the various alloys perform. I have skimmed the report recommended by Dave Hillman, available at http://www.acqp2.nasa.gov/LFS.htm but cannot see a clear recommendation.
My stock of SAC305 solder bar is almost depleted and I have to make a decision: shall I continue with SAC305, or switch to SN100C or SACX?
Beyond the cosmetics of the joints and the maintainability of the solder pot, what is your feedback on reliability? Since I am running SAC305 paste, if I use a different alloy at wave, shall I expect more trouble than having the same SAC305 in both processes?
Thanks,
Ioan
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