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Subject:	Re: Etch Factor Design Guidelines
From:	mattyk <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Wed, 16 Aug 2006 13:59:24 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (69 lines)

What I have in a couple specs:

Cu Thickness     Min Trace   Min Space

0.5oz               3.5        4
1.0oz               4          4
2.0oz               6          6
3.0oz               8          10
4.0oz               9          12
5.0oz                     10         15
6.0oz                     11         18

Now for the 3.5/4 and 4/4 depends on the fab house. Not all fab houses are
equiped to handle less than 5/5, and they go to an outside vendor for those
they're not equiped to do. So if you can, it's good to stay to 5/5 or 4/5 at
least. Plus these days, there are some fab house's that can do 3/3.5, but I
wouldn't design with that.

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Babcock
John
Sent: Wednesday, August 16, 2006 12:46 PM
To: [log in to unmask]
Subject: [DC] Etch Factor Design Guidelines

I have a question.  Did you ever develop good guideline numbers for trace
and space when dealing with etch factor?

I've been hearing all kinds of different (minimum) trace/space numbers
lately when dealing with different copper thicknesses.

Cu Thickness    Trace           Space

0.5oz                5          5
1.0oz                8          8
2.0oz                12         12
3.0oz                20         20
4.0oz                25         25

Are these in the ballpark with your guidelines?


John Babcock, C.I.D.
PCB Designer III
Phone: 509.241.4641
www.spraycool.com

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