Did I read that right? At lower temperatures used for soldering 63/37
solder, you are getting hole wall pullaway on pwbs that are meant for
much higher lead-free process temps? Then I assume the problem would be
much worse if you had soldered at higher temps?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: Tuesday, August 01, 2006 9:52 AM
To: [log in to unmask]
Subject: Re: [TN] Barrel to Laminate Adhesion loss
Recently we have been seeing hole wall pull away associated with some of
the "lead free" materials exposed to thermal excursions to "tin lead"
assembly temperatures.
The most recent "hole wall pull away" has been significant, and, in the
worst instances, caused post separation.
Sincerely,
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario
Canada, K2H 9C1
613 596 4244 ext. 229
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kerry McMullen
Sent: Tuesday, August 01, 2006 9:46 AM
To: [log in to unmask]
Subject: [TN] Barrel to Laminate Adhesion loss
Esteemed Tech-net,
What are the causes of Barrel to Laminate Adhesion loss?
TIA,
Kerry
Kerry McMullen
Principal New Product Mfg. Engineer
LTX Corporation
50 Rosemont Road
Westwood, MA 02090-2306
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