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Date: | Thu, 31 Aug 2006 10:15:05 +0300 |
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Dear Technetter
As you know that excessive copper rate in both Sn/Pb and SAC305 may
cause soldering problem on assembly side. For eutectic Sn/Pb solder for
ex 63/37 copper rate should not be more than 0.25 %. We could smear
excess copper on molten solder. We heat up the solder up to 240-250 C
and then strat to cool it down to 183 C which is the temperature of
copper melting point, other alloys settle down and copper gathers on the
surface and we smear it. This is one of the reducinmg copper rate for
63/37 Sn/Pb solder.
During the HAL process when soldering process is continuing copper rate
increase gradually so we need to decrease copper rate. In this view, we
want to learn that if there is any method to reduce the excessive copper
in SAC305, do you have any experinece aor have you heard of any method
to reduce copper inside SAC305
Best Regards
--
Yusuf GÖMEÇ
Process Engineer
BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey
Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
00 90 216 4913269
Gsm: 00 90 533 6579897
00 90 533 7480014
msn: [log in to unmask]
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